A8735: Ultra Small Mobile Phone Xenon Photoflash Capacitor Charger with IGBT Driver

Description

These parts are discontinued. Samples are no longer available. For new customers or new applications, please contact Allegro. Date of status change: December 2, 2013.

The AllegroA8735 is a Xenon photoflash charger IC designed to meet the needs of ultra low power, small form factor cameras, particularly camera phones. By using primary-side voltage sensing, the need for a secondary-side resistive voltage divider is eliminated. This has the additional benefit of reducing leakage currents on the secondary side of the transformer. To extend battery life, the A8735 features very low supply current draw (0.5 µA max in shutdown mode). The IGBT driver also has internal gate resistors for minimum external component count. The charge and trigger voltage logic thresholds are set at 1 V(min) to support applications implementing low-voltage control logic.

The A8735 is available in an 8-contact 2 mm × 2 mm DFN/MLP package with a 0.60 maximum overall package height, and an exposed pad for enhanced thermal performance. It is lead (Pb) free with 100% matte tin leadframe plating.

Top Features

  • Ultra small 2 × 2 DFN/MLP-8 package
  • Low quiescent current draw (0.5 µA max. in shutdown mode)
  • Primary-side output voltage sensing; no resistor divider required
  • Fixed 1 A peak current limit
  • 1V logic (V(min)) compatibility
  • Integrated IGBT driver with internal gate resistors
  • Optimized for mobile phone, 1-cell Li+ battery applications
  • Zero-voltage switching for lower loss
  • >75% efficiency
  • Charge complete indication
  • Integrated 50 V DMOS switch with self-clamping protection

Part Number Specifications and Availability

Part Number Package Type Temperature RoHS
Compliant
Part Composition /
RoHS Data
Comments Samples Check Stock
A8735EEETR-T 8-lead DFN -40°C to 85°C Yes View Data 停止 Contact your
local sales rep
Check
Distributor Stock

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Packaging

The A8735 is available in an 8-contact 2 mm × 2 mm DFN/MLP package (suffix EE) with a 0.60 maximum overall package height, and an exposed pad for enhanced thermal performance. It is lead (Pb) free with 100% matte tin leadframe plating.

EE-DFN 8 lead with exposed pad