Part Number | Package Type | Temperature | RoHS Compliant |
Part Composition / RoHS Data |
Comments | Samples | Check Stock |
---|---|---|---|---|---|---|---|
APEK6261KLJ-01-MH | DEMO BOARD | -20°C to 85°C | No | -- | Contact your local sales rep |
Check Distributor Stock |
|
A6261ELPTR-T | 16-lead TSSOP | -40°C to 85°C | Yes | View Data | Contact your local sales rep |
Check Distributor Stock |
|
A6261KLJTR-T | 8-lead SOIC | -40°C to 125°C | Yes | View Data | Contact your local sales rep |
Check Distributor Stock |
|
A6261KLJTR-T-1 | 8-lead SOIC | -40°C to 125°C | Yes | View Data | Contact your local sales rep |
Check Distributor Stock |
|
A6261KLPTR-T | 16-lead TSSOP | -40°C to 125°C | Yes | View Data | Contact your local sales rep |
Check Distributor Stock |
|
A6261KLYTR-T | 10-lead MSOP | -40°C to 125°C | Yes | View Data | Contact your local sales rep |
Check Distributor Stock |
|
APEK6261KLP-01-T | DEMO BOARD | -40°C to 125°C | No | -- | Contact your local sales rep |
Check Distributor Stock |
|
APEK6261KLY-01-T | DEMO BOARD | -40°C to 125°C | No | -- | Contact your local sales rep |
Check Distributor Stock |
Allegro 的产品不允许在任何由于 Allegro 产品的合理故障造成人身伤害的装置或系统中使用,包括但不限于生命支持装置或系统。
该器件采用 8 引脚 SOICN(后缀 LJ)、10 引脚 MSOP 封装 (LY) 和 16 引脚 TSSOP (LP),全部带外露隔热盘以增强散热。有关封装均为无铅产品,且引脚框采用 100% 雾锡电镀。