亚博棋牌游戏Allegro MicroSystems, LLC, a new band of ABS wheel-speed sensor for double IC integration capacitor

亚博棋牌游戏Allegro MicroSystems, LLC, a new band of ABS wheel-speed sensor for double IC integration capacitor

July 8, 2014

Market leading performance, subminiature encapsulation

Worcester, Massachusetts-亚博棋牌游戏 Allegro MicroSystems, LLC, a new integrated circuit (IC) of hall effect, can really zero velocity for two-wire applications digital ring magnet and gear tooth sensor provides user friendly solution.Allegro 'A1688 wheel-speed sensor ICMainly take the car market, it contains more than one industry leading function, such as excellent pitch deviation accuracy, consistent I_CCDistribution: > six sigma, low jitter and enhanced EMC performance, simple module assembly, use the built-in capacitor and the pins with wider width/intervals.

The integrated circuit will double component combination of hall effect circuit and signal processing, can response to differential magnetic signals generated by the magnetic encoder and switch operation, or if appropriate compensation by magnet deviation, the response to differential magnetic signals generated by ferromagnetic targets for switch operation.The device contains complex digital circuit, can reduce the magnet bias, calibration of the air gap and system independent switch point gain and provide true zero speed operation.Device through the offset and gain adjustment to electricity can optimize the signal, and in the use of model calibration mechanism keep signal optimization during the work.Running model calibration can eliminate sensor target at startup or sudden changes in the air gap of micro vibration impact on the environment, etc.

Adjustable output current for two-wire interface circuit configuration, the speed and very suitable for wheel speed application information.Hall element spacing is designed for high resolution, small diameter optimization target.A1688 with UB encapsulation, in a single mold SIP integrated IC and high temperature ceramic capacitor encapsulation.Fog the encapsulated as lead-free packaging, with 100% of tin plating pin frame.The integration capacitor is not only provide higher EMC performance, and reduce the number of external components.